Real Time Electronic Enclosure Cooling System - US 8857204 - October 14, 2014
Multistage Evaporative Cooling System - US 8899061 - December 2, 2015
International Patent Application Multistage Evaporative Cooling System - March 27, 2014
Below is a status on our patents. The complete file wrappers are available on the public pair website of the USPTO. http://portal.uspto.gov/pair/PublicPair Search the Patent Numbers 8899061 and 8857204 (no / or commas) to see all information on the patent.
Current Patents: The first patented system is the Multistage Evaporative Cooling System (MECS). Notice of Allowance was issued by the USPTO in August 2014 on our Advanced Multi-Purpose, Multi-stage Evaporative Cold Water/Cold Air Generating and Supply System US Patent Application Number 13/624912 and a US Patent Number 8,899,061 published on December 2 2014. The second patented system is the Real Time Individual Electronic Enclosure Cooling System (hereinafter Individual Server Enclosure Cooling System or ISECS). Notice of Allowance was issued by the USPTO in August on our Real Time Individual Electronic Enclosure Cooling System – US Patent Application Number 13/748088 and US Patent Number 8,857,204 published on October 14, 2014. A Real Time Data Center Cooling System (RTDCCS) is created by combining the Individual Server Enclosure Cooling System (ISECS) with MECS. By combining these two cooling solutions, the RTDCCS can save data centers 60 to 85% of their cooling energy costs.
Current USPTO Continuation and Continuation in Part Filings: R4 Ventures LLC filed continuations on both the Advanced Multi-Purpose, Multi-stage Evaporative Cold Water/Cold Air Generating and Supply System – Patent Number 8,899,061 (Multistage Evaporative Cooling System or MECS) and the Real Time Individual Electronic Enclosure Cooling System – Patent Number 8,857,204 on October 13, 2014. Additionally, continuations in part (CIP) were filed on October 13, 2014 on both of these patents making the cooling systems even more energy efficient and functional. In the October 13, 2014 CIP filing, MECS is being improved by adding a Supplemental Cooling Module (for example absorption chiller, adsorption chiller or any other cold water source (i.e. ocean, lake, river, geothermal, etc.) in place of Cooling Tower 3) serving cooling applications in high humidity regions of the world making MECS a truly worldwide product. Also in a separate CIP filing October 13, 2014, the Real Time Individual Electronic Enclosure Cooling System is being improved by integrating the control system of the Individual Server Enclosure Cooling System (Fan Coil Unit) to control the fans and air flow dampers of individual servers within a server rack. Important note, 20 to 40% of the power used by servers is used by the server’s internal fans cooling the servers. The ISECS fan(s) can provide most, if not all, the air flow draw through the servers allowing for the server fans to be slowed considerably and disabled. This improvement can save Billions of additional dollars in data center cooling costs by cutting the IT power in data centers at the server level by an additional 10 to 40% on top of what MECS and the ISECS can already save in energy costs.
R4 Ventures LLC’s patent estate now consists of 2 US patents, 1 International PCT patent application pending, 2 US patent continuations, and 2 US patent continuations in part.
Crenlo’s Emcor Enclosures and R4 Ventures Enter Partnership -- Data Centers Can
Reduce Energy Costs up to 85% with New Cooling Technologies Press Release July 23,2015
R4 Ventures LLC / Kinetic Systems Inc sign international patent licensing and contract manufacturing agreement
Press Release January 27, 2015
Our purpose is to create superior energy, environmental, security and human life sustaining (water, nutrition) technologies and solutions for our licensees; global partners; engineering firms, mechanical contractors, customers; and local, regional, national, and global governments through the engineer, design, research, develop, and commercialization of innovative technologies and solutions in our industries of expertise in a cost effective, safe, reliable, efficient and environmentally sound manner.
9440 N 32nd Ave., Suite 1123
Phoenix, AZ 85051
R4 Ventures LLC (R4V), a Research and Development company, has developed new disruptive commercial and industrial cooling technologies based on the earth’s natural water cycle and eliminates high energy consuming compressors and environmentally hazardous refrigerants. Our Green / Clean-tech patented technologies incorporating evaporative cooling systems and evaporative cooling towers provides cold water and/or cold air temperatures close to temperatures generated by traditional mechanical refrigeration systems such as chillers and central cooling plants at reduced first costs of the system and significant cooling energy cost savings of 60 to 85%. R4V’s initial focus is on the Data Center (DC) market which currently uses 2.5% of the total electricity produced in the United States in the operation of DCs with 40% of this electricity being used for cooling DC server racks equating to a $16+ Billion market opportunity.
The R4V cooling solutions are disruptive technologies that will transform the way we cool Data Centers, Commercial Buildings, Industrial Buildings, Manufacturing Plants, and Processing Plants. Process cooling market focus is on large industrial markets which benefit greatly from the resulting increased efficiency and product production from an inexpensive method of producing lower temperatures of process cold water and air. Numerous industries will benefit from this including Electric Utilities (Natural Gas Combustion Turbine Inlet Air Cooling and Air Cooling Condensers), Oil and Gas Refineries and Pipelines (Compressed Air Systems (Inlet Air Cooling and Process Cooling Water), Food Processing Plants (Process Cooling Water), Chemical and Gases Processing Facilities (Process Cooling Water) and Metal, Plastics, and Semi-conductor Manufacturing Facilities (Process Cooling Water). By inexpensively reducing process cooling water and air temperatures, process efficencies and product production can be increased by 5 to 25%.