Current Patents: The first patented system is the Multistage Evaporative Cooling System (MECS). Notice of Allowance was issued by the USPTO in August 2014 on our Advanced Multi-Purpose, Multi-stage Evaporative Cold Water/Cold Air Generating and Supply System US Patent Application Number 13/624912 and a US Patent Number 8,899,061 published on December 2 2014. The second patented system is the Real Time Individual Electronic Enclosure Cooling System (hereinafter Individual Server Enclosure Cooling System or ISECS). Notice of Allowance was issued by the USPTO in August on our Real Time Individual Electronic Enclosure Cooling System – US Patent Application Number 13/748088 and US Patent Number 8,857,204 published on October 14, 2014. A Real Time Data Center Cooling System (RTDCCS) is created by combining ISECS with MECS. By combining these two cooling solutions, the RTDCCS can save data centers 60 to 85% of their cooling energy costs.
Current USPTO Continuation and Continuation in Part Filings: R4 Ventures LLC filed continuations on both the Advanced Multi-Purpose, Multi-stage Evaporative Cold Water/Cold Air Generating and Supply System – Application Number 13/624,912 (Multistage Evaporative Cooling System or MECS) and the Real Time Individual Electronic Enclosure Cooling System – Application Number 13/748,088 on October 13, 2014. Additionally, continuations in part were filed on October 13, 2014 on both of these patents making the cooling systems even more energy efficient and functional. In the October 13, 2014 CIP filing, MECS is being improved by adding a Supplemental Cooling Module (for example absorption chiller, adsorption chiller or any other cold water source(i.e. ocean, lake, river, geothermal, etc.) in place of Cooling Tower 3) serving cooling applications in high humidity regions of the world making MECS a truly worldwide product. Also in a separate CIP filing October 13, 2014, the Real Time Individual Electronic Enclosure Cooling System is being improved by integrating the control system of the Individual Server Enclosure Cooling System (Fan Coil Unit) to control the fans and air flow dampers of individual servers within a server rack. Important note, 20 to 40% of the power used by servers is used by the server’s internal fans cooling the servers. The ISECS fan(s) can provide most, if not all, the air flow draw through the servers allowing for the server fans to be slowed considerably and disabled. This improvement can save Billions of additional dollars in data center cooling costs by cutting the IT power in data centers at the server level by an additional 10 to 40% on top of what MECS and the ISECS can already save in energy costs.
R4 Ventures LLC’s patent estate now consists of 2 US patents, 1 International PCT patent application pending, 2 US patent continuations, and 2 US patent continuations in part.
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